You have entered an incorrect email address! However, at least TI[1] and Fairchild consistently refer to JEDEC 3.9 and 7.5 mm width parts as "SOIC" and EIAJ Type II 5.3 mm width parts as "SOP.". I have been looking at the pins of the HC595 in SOIC-16 and SO-16 formats. So it shouldn’t be too hard to adjust on runs. It is an SMD with all DIP pins bent outwards and shrunk down to size. On SOIC packages, each pin is usually spaced by about 0.05" (1.27mm) from the next. Some manufacturers offer the same part in both 0.15 and 0.3 inch packages - MAX232 springs to mind, 0.15 and 0.3 inch. But the footprint looks like SOIC. Is there a difference between SOIC and SOP? I want to replace 74AC153 IC of Fairchild by CD74AC153 IC from Texas. So besides TI, do other manufactures also have different SOP and SOIC foot prints? This yields an IC package which is a significant reduction in the size (compared to standard package). Puzzled by SOIC8 vs SOP8. Career advice and jobs related to electronics and IOT. Designing & building electrical circuits for over 25 years. Great resource for users, buyers & sellers of T&M solutions. Writing letter of recommendation for someone I have never met, Proving Ridge Regression is strictly convex, Two ways to remove duplicates from a list. ***i actually mean SOIC, rather than SOP.... in case anyone is worried or it makes a difference*** Last edited by a moderator: Oct 27, 2016. The difference is mainly related to the parameters WB and WL.

Oct 20, 2005 #2 in my experience, so-8 is just shorthand for soic-8 but it would be best to compare your pad layout, whichever you decide on to the pad layout the manuf.


It only takes a minute to sign up. crutschow. If you don't have a planet, what good are gold bars? Things To Take Care Of For Network Testing, Self-Driving Electric Vehicle For Delivery, World’s Top 30 Electrical Engineering Project Ideas, 9 Free And Open Source Software For Circuit Designing, Technology For High-Performing And Complex AI Electronics, Job: Graduate & Technician Apprentices At BDL, JOB: IT Analyst/Developer C# At Sherwin Williams, New IC Reduces Volume of AC-DC Converters By Up To 40 Per Cent, Unique Prototyping Platform Integrates Microelectronics and Fluid Handling, Open-Source Industrial SBC Powered By ARM Cortex-A5 SoC, Solving Water Crisis With Air And Nanotechnology, Design Your Own Electric Vehicle Battery Charging Solutions. site design / logo © 2020 Stack Exchange Inc; user contributions licensed under cc by-sa. Never trust the manufacturer's package name. Can Drones Be Used To Save A Patient’s Life? Small-outline package (SOP) This is an even smaller version of SOIC package.

Pins on a QFP IC are usually spaced anywhere from 0.4mm to 1mm apart. SMD devices such as rectangular transistors are available in SOT packages. [4] 0.5 mm lead spacing is less common, but not rare. The eagle 40xx library part 4050 adds to the confusion. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high frequency applications. TSSOP is Thin SSOP. Whether differences like these are "important" depend on your application. There are slight differences, but basically they are the same. Thanks guys! Similar to SOIC, SOP family has a smaller form factor, with pin spacing less than 1.27mm. It is the most common through-hole IC package used in circuits, especially hobby projects. The wider JEITA/EIAJ packages are more common with higher pin count ICs, but there is no guarantee that an SOIC package with any number of pins will be either one or the other. They seem (almost) identical (pitch, overall size, etc...). rev 2020.11.4.37941, The best answers are voted up and rise to the top, Electrical Engineering Stack Exchange works best with JavaScript enabled, Start here for a quick overview of the site, Detailed answers to any questions you might have, Discuss the workings and policies of this site, Learn more about Stack Overflow the company, Learn more about hiring developers or posting ads with us. If you want to be sure, check the package drawings. SOIC and SO are the same. It's what you'd get if you bent all the pins on a DIP outward, and shrunk it down to size. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon / GaAs technologies are well addressed by the SSOP product family. How can I get rid of common areas in this plot? Small-Outline (SOP) Small-outline IC (SOIC) packages are the surface-mount cousin of the DIP.

Available for Design & Build services. The SSOP (shrink small-outline package) is an even smaller version of SOIC packages. Each SOP includes a plastic small-outline package (PSOP), thin small-outline package (TSOP) and thin-shrink small-outline package (TSSOP). This is an even smaller version of SOIC package. Overall dimensions of a DIP package depend on its pin count. It's possible to get the same part in various widths - 0.15, 0.2 and 0.3 inch. Similar to SOIC, SOP family has a smaller form factor, with pin spacing less than 1.27mm. This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing. Yes, there are subtle differences that may or may not affect a particular design. They are generally available in the same pin-outs as their counterpart DIP ICs. • What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes 1.2 WHAT IS THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD? SOP SOIC Is there any important differences between these two packages th... Stack Exchange Network Stack Exchange network consists of 176 Q&A communities including Stack Overflow , the largest, most trusted online community for developers to learn, share their knowledge, and build their careers. JavaScript is disabled. Each package has multiple names in general. What Are The Differences Between SMD, SMT and THT? (4.9mm vs. 3.0mm) and only a bit wider. SSOP is different with a smaller pin spacing. Many electronic retailers will list parts in either package as SOIC whether they are referring to the JEDEC or JEITA/EIAJ standards. With a steady hand, and a close eye, these packages are among the easiest SMD parts to hand solder. I know that the IO pins are the same, of course. Is it a good idea to shove your arm down a werewolf's throat if you only want to incapacitate them? Another SOIC variant, available only for 8-pins and 10-pins ICs, is the mini-SOIC, also called micro-SOIC. What prevents dragons from destroying or ruling Middle-earth? I’m looking at one of those smaller pick and place jobbers. puzzled about BGA package, lot more Flash and RAM, LED Strip Lighting in Series Puzzled by Power Draw. The 0.2 inch package seldom shows up in the west but is/was very popular in Japan, so beware if you buy chips from Asian sellers on Ebay. Don't forget to check the width when you order them. The convention for naming the package is SOIC or SO followed by the number of pins. Seems pretty much the same size. Why are SMD Diodes different Packages than Resistors and Capacitors? Did I miss something? SSOP is different with a smaller pin spacing. Sometimes, instead of soldering an IC directly to the PCB, an IC socket is used. So besides TI, do other manufactures also have different SOP and SOIC foot prints? A TSSOP's leg count can range from 8 to 64. After SOIC came a family of smaller form factors with pin spacings less than 1.27 mm: Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.0256 inches (0.65 mm) or 0.025 inches (0.635 mm). These dimensions differ depending on the SOIC in question, and there are several variants. A Type I TSSOP has legs protruding from the width portion of the package. A platform for tech faculty and institutions, Enabling commerce between buyers & sellers of electronics in India, Everything you want to know about India's electronics industry, Enabling you to benefit from investments in technology, New-Generation Automotive Electronics, Infotronics and Skilled Workforce. There is another QFP IC type, but with a different pin structure, called QFN package. Difference between wire wound and ceramic chip inductors, Clip type for in-system programming (SOIC8 vs DIP8), Altium: What stands for 'N' , 'M' and 'L' as a suffix for SOIC packages. TSSOP is Thin SSOP. Chip on board is a packaging technique that directly connects a die to a PCB, without an … A resource for professional design engineers. Linear aproximation of an inductor in a switch circuit. Yes, you can substitute one for the other. There seems to be a difference to the thickness but other than that looks like it would fit on the same pads. http://en.wikipedia.org/wiki/Small_Outline_Integrated_Circuit, http://www.dipmicro.com/store/74HC4050-SOIC, http://en.wikipedia.org/wiki/List_of_electronics_package_dimensions, http://www.crossroadsfencing.com/BobuinoRev17/. A thin-shrink small-outline package (TSSOP) is a rectangular, thin body size component. Thanks for confirming. For a better experience, please enable JavaScript in your browser before proceeding.

List of integrated circuit packaging types, https://en.wikipedia.org/w/index.php?title=Small_outline_integrated_circuit&oldid=960316003, Short description is different from Wikidata, Articles needing additional references from December 2011, All articles needing additional references, Creative Commons Attribution-ShareAlike License, Thin-shrink small outline package (TSSOP), This page was last edited on 2 June 2020, at 08:20. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. Scroll to continue with content. is there a standard name for surface-mounted 0.1" pitch DIP packages? Like Reply. TSSOP are sweet. Podcast 283: Cleaning up the cloud to help fight climate change, Creating new Help Center documents for Review queues: Project overview. To subscribe to this RSS feed, copy and paste this URL into your RSS reader. whats the difference bet SOIC-8 and SO-8 Package?Can I use SO-8 Package in place of SOIC-8 packege in layout ? The values of these dimensions (in mm) for common SOICs is shown in the table. Screw Shield for Mega/Due/Uno,  Bobuino with ATMega1284P, & other '328P & '1284P creations & offerings at  my website. Difference Between Policies & Procedures Vs. SOPs. Note: it is not just SOP, it is 8-SOP-225, looks like an arbitrary number. Electrical Engineering Stack Exchange is a question and answer site for electronics and electrical engineering professionals, students, and enthusiasts.
These are sometimes called "wide SOIC," as opposed to the narrower JEDEC MS-012, but they in turn are narrower than the JEDEC MS-013, which may also be called "wide SOIC.". Thanks guys! I suppose if the width and pitch is ok it should work. The pins on a DIP IC are spaced 2.54mm apart, which is a standard spacing—perfect for fitting into breadboards, veroboards and other prototyping boards.


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